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深圳市正特电子有限公司成立于2007年,是一家以生产多层印制电路板为主的高新技术企业。工厂位于深圳宝安区沙井 现有 10000 余平方米的厂房,350多名员工。公司拥有一支经验丰富、具有热诚服务精神的人才队伍,拥有各种先进的配套生产设备,高素质的工程技术人员,以及日臻完善的管理和服务体系。自创建以来,规模迅速发展,逐渐健全了从市场开发,工程设计,到加工生产的一条龙服务。产品取得ISO9001、SGS认证,同时也获得欧盟ROHS无铅产品认证和美国UL认证... 更多

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Characteristic IPC-600G Guideline * Zhengte Inspection
Board edges
  • Haloing and nicks maximum 0.100" or 50% of distance to nearest conductor, whichever is less.
  • Final inspection
Bow and twist
  • General 1.5% max.
  • SMT boards 0.75%. max.
  • Final inspection
Conductor thickness
  • Table 3-9 (external)
  • Table 3-8 (internal)
  • Measurement made at post etch inspection
  • Measurement made at post etch inspection
Copper plating thickness,
minimum in holes
  • Class 2, avg. 0.0008" , thin spots 0.0007"
  • Class 3, avg. 0.001", thin spots 0.0008" (Table 3-2)
  • Sample of holes measured by PTX to determine average plated hole thickness.
Copper plating voids
  • Class 2 - One Cu void allowed per hole in not more than 5% of the holes.
  • Class 3 - No Cu voids allowed.
  • Shall not exceed 5% of hole length or 90° of circumference (Table 3-3)
  • Sample visual inspection after etching· cross section referee
  • Sample visual inspection after etching· cross section referee
Delamination/blisters
  • Evaluated in accordance with IPC-A-600
  • Class 1 now same as Class 2, 3 (2.3.3)
  • Evidence of delamination in micro section now refers to 2.3.3 instead of being automatically nonconforming (3.1.4)
  • Post-final surface finish inspection / final inspection
Solder Dewetting
  • Ground planes and traces: allowed
  • Solder connection areas: max. 5% (Class 2, 3)
  • Post-final surface finish inspection / final inspection
Finish plating voids
  • Class 2 - Three solder voids allowed per hole in not more than 5% of the holes.
  • Class 3 - One solder void per hole in not more than 5% of the holes.
  • Shall not exceed 5% of hole length or 90° of circumference (Table 3-3)
  •  Post-final surface finish inspection / final inspection
Foreign inclusions
  •  Evaluated in accordance with IPC-A-600, except no maximum dimension specified (3.3.2.1)
  • Post-final surface finish inspection
Gold thickness
  •  Class 2 - min. 30µ"· Class 3 - min. 50µ"· Solderable gold - 30µ" maximum.
  • Beta-backscatter or XRF measurement on sample after gold plating
Hole location
  • As specified on procurement document.
  • In-process visual inspection (after etching, before mask)
Hole sizes
  •  ±0.005" for plated through holes, ±0.003" for non-plated through holes, +0.003" / - hole size for vias, unless otherwise specified by customer
  • Hole sizes not verified for Express product. All other product lines: plug gauge measurements made.
Solder Mask coverage
  • See 3.8.1
  • Post-final surface finish inspection
Solder Mask cure &
adhesion
  • No tackiness
  • Blisters/delamination: 2 per side, max. 0.010 in, does not reduce spacing by more than 25%
  • Soda-strawing is now defined as applying to DFSM only (2.9.9)
  • Post-final surface finish inspection
Solder Mask in holes
  • Allowed only in holes in which are not to be soldered.
  • Post-final surface finish inspection
Solder Mask registration
  • Post-final surface finish inspection
Solder Mask thickness
  • Visual coverage; no thickness requirement
  • Not checked unless specifically required by drawing
Solder Mask touch-up
  • Touch-up material specified (IPC-A-600G 2.9.1)
  • Post-final surface finish inspection
Measles/crazing
  • Evaluated in accordance with IPC-A-600
  • Measles acceptable for all except high voltage applications [not defined] (2.3.1)
  • Crazing spec. now same as delamination except 50% of distance between conductors may be spanned; also now shows pictures of crazing (2.3.2)
  • In-process inspection (after etch, before solder mask)
Min. ann. ring NPTH
  • Class 2: No breakout allowed.
  • Final inspection
Min. ann. ring-internal
  • Class 2: 90° breakout allowed
  • Process control using etched drill panel (selecting the design review option ensures design is within capability).
Min. external ann. ring - PTH
  •  Class 2: 90° breakout allowed except at junction of pad and trace, where .002" minimum is allowed.
  • In-process inspection (after etch, before mask). Selecting the design check option ensures design is within capability.
Nomenclature (silkscreen)
  •  Refers to IPC-A-600 for legibility requirements Marking ink on surface mount lands no longer nonconforming (IPC-A-600G 2.8.3)
  • Final inspection
Nonwetting
  • None allowed
  • Post-final surface finish inspection
Pink ring
  • Acceptable (3.3.2.6)
 
Pits and voids in base material
  • Acceptable if no larger than 0.8 mm [0.03 in] and no more than 5% of board area
  • Post-final surface finish inspection
Plating adhesion
  • Tape test required (slivers coming off with tape is not cause for rejection)
  • In-process inspection (after etch, before mask)
Plating cracks
  • See Table 3-7 (basically none allowed)
  • In-process visual inspection (after etch, before mask) cross section referee
Resin fill of blind/buried vias
  • Buried vias shall be at least 60% filled with resin (3.3.14)
  • Not applicable
Routing tolerances
  • As specified on procurement document.
  • Final inspection; sample checked per customer drawing or default to ±.010
Spacing reduction
  •  When not specified on the customer's documentation, 30% allowed for class 2; 20% allowed for class 3.
  • Post-final surface finish inspection (when required)
Tenting (via holes)  
  • Post-final surface finish inspection (when required)
Tin/lead, solder coat
  • Unfused tin/lead: min. thickness 0.0003"
  • Fused or HAL: coverage and solderable.
  • Sidewalls do not have to be covered.
  • Post-final surface finish inspection
Trace width
  • Class 2, 3: When not specified on the customer's documentation, 20% max. line loss, additional 20% for isolated defects
  • In-process measurement / inspection (after etch, before mask)
Weave exposure and
exposed/disrupted fibers
  •  Acceptable for Class 1, 2, 3 as long as minimum conductor spacing is met.
  • In-process inspection (after etch, before mask)
Weave texture
  • Not addressed
  • Not applicable
Documentation Retention
  • Evidence of Inspection and / or Testing
  • Express Product 90 Days
  • PCB123 Product 90 Days
  • Full-Feature Product 3 Years
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